Shenzhen Sunsom automatic equipment Co.,Ltd .
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Price: | 1.0~2.0 USD |
Payment Terms: | T/T,L/C,D/A,D/P,WU |
Place of Origin: | Guangdong, China (Mainland) |
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Hot ACF bonding machine equipment for glass IC on COG COF FPC
1.About the application field of ACF attached (pre-paste) machine equipment XCF50-A2.
ACF attached (pre-paste) machine equipment XCF50-A2 is mainly used in the process COG driver IC and LCD GLASS poor bonding after heavy maintenance cleaning. Such as. LCD TV, LCD monitors, notebook computers, LCD, LCM manufacturers and so on.
2.About the basic parameters of ACF attached (pre-paste) machine equipment XCF50-A2.
2.1Device Power. AC220V 50-60Hz
2.2 Device Color. rack surface after paint handling, color is "sunsom" color
2.3 Weight. to prevail in kind
2.4 Dimensions. L450 * W400 * H360mm
2.5 Heating. heating thermostat
3,About the functions and characteristics of ACF attached (pre-paste) machine equipment XCF50-A2.
3.1 is simple to operate, compact device
3.2 Time Setting flexible
3.3 Temperature control convenience
3.4 Cleaning shorter